Izmo Shares Soar 5% on Breakthrough Space Electronics Module
Overview
Izmo Ltd. shares jumped 4.6% after its division, Izmo Microsystems, developed a compact 3D System-in-Package (SiP) module for space electronics. This indigenous technology achieves an 84% footprint reduction and enhances India's capability in critical aerospace applications.
Stocks Mentioned
Space Electronics Breakthrough
Izmo Ltd. shares surged 4.6% on the BSE on Wednesday, closing at ₹743.85 per share. This significant jump followed the announcement that its subsidiary, Izmo Microsystems, has successfully designed a highly complex 3D System-in-Package (SiP) module for Space Payload Camera Electronics.
Compact Design Achieved
Leveraging advanced "3D stacking" technology, Izmo Microsystems re-engineered a standard 200mm x 200mm electronics board into a significantly smaller 81mm x 81mm module. This marks an impressive 84% reduction in footprint, a critical advantage for space applications where physical space is extremely limited.
Indigenous Capability and Global Edge
The module integrates "bare-die" components directly using high-density wiring, bypassing bulky packaged chips. It is enclosed in a fully indigenised, custom hermetic ceramic package, designed and fabricated in India. This achievement positions Izmo Microsystems among a select group of global Tier-1 aerospace firms capable of such advanced integration, reducing reliance on restricted foreign technologies and establishing a sovereign technical foundation for future silicon photonics and quantum communications.
